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How to Choose the Suitable Release Film for Electronic Die-Cutting?

With the continuous development of electronic devices towards miniaturization, high density, and high precision, the importance of electronic die-cutting technology is increasing day by day. In the entire die-cutting process, release film plays a crucial role as an "auxiliary carrier" for adhesive materials. High quality release film not only affects the die-cutting accuracy and yield of products, but also directly affects the stability and efficiency of the entire automated processing. So, among numerous release film products, how can companies choose high-precision release films that are truly suitable for electronic die-cutting? The most commonly used release film substrates in electronic die-cutting are PET (polyester film), BOPP (biaxially oriented polypropylene), PE (polyethylene), etc. Among them, PET substrates are widely used due to their high strength, high temperature stability, and good size control ability, especially suitable for application scenarios that require high die-cutting accuracy and strong carrier stiffness.

With the continuous development of electronic devices towards miniaturization, high density, and high precision, the importance of electronic die-cutting technology is increasing day by day. In the entire die-cutting process, release film plays a crucial role as an "auxiliary carrier" for adhesive materials. High quality release film not only affects the die-cutting accuracy and yield of products, but also directly affects the stability and efficiency of the entire automated processing. So, among numerous release film products, how can companies choose high-precision release films that are truly suitable for electronic die-cutting?

 

The most commonly used release film substrates in electronic die-cutting are PET (polyester film), BOPP (biaxially oriented polypropylene), PE (polyethylene), etc. Among them, PET substrates are widely used due to their high strength, high temperature stability, and good size control ability, especially suitable for application scenarios that require high die-cutting accuracy and strong carrier stiffness.

 

The selection of substrate should pay attention to the following points:

1. Thickness range: Common thicknesses include 12 μ m, 25 μ m, 36 μ m, 50 μ m, 75 μ m, 100 μ m, etc. The higher the thickness, the stronger the rigidity, making it suitable for large-area die-cutting or multi-layer composite;

2. Thermal shrinkage rate: PET has better thermal stability than PE/OPP, and is suitable for maintaining size without deformation in high-temperature environments such as hot pressing, bonding, or heat cutting;

3.  Tensile strength: determines whether the release film will break or stretch on the high-speed die-cutting machine, affecting the die-cutting accuracy and smooth waste discharge.

 

By comparison, it is recommended to choose PET material with moderate thickness (36-75 μ m), low thermal shrinkage rate, and moderate ductility for high-precision die-cutting, which balances stiffness and flexibility.

 

Peel strength is one of the most critical properties of release films. It refers to the force required for the adhesive material to peel off after coming into contact with the release film. Improper selection can lead to problems such as residual glue, wire drawing, breakage, material dropping, and difficult bonding of die cut products.

 

In addition, different die-cutting equipment, temperature and humidity conditions, and bonding media can also affect the actual peeling performance. Therefore, it is recommended to conduct sample testing to ensure the best match between peeling force and adhesive material. Some suppliers also support customized "step stripping" films for die-cutting of various material combinations to enhance process flexibility.

 

Different die-cutting equipment (such as fully automatic die-cutting machines, semi-automatic waste disposal equipment, laser die-cutting machines) have different requirements for the width, length, inner diameter of paper tubes, and tensile resistance of release films. Therefore, when selecting release film, it is necessary to match it according to one's own die-cutting equipment.

 

Suggestions for die cutting adaptability:

1. Flatness and tension uniformity of the coil: avoid wrinkling and deviation during operation;

2. Surface friction coefficient: affects the smoothness of feeding and die-cutting efficiency;

3. Temperature resistance: For hot die cutting or composite bonding die cutting, it is recommended to use heat-resistant PET substrate to avoid deformation;

4. Customizable processing capability: Does it support integrated solutions for cutting, bonding, punching, laminating, and other processes to improve efficiency.

 

Mastering the core points of the five dimensions of substrate, peel strength, cleanliness, adaptability, and supply chain will help enterprises select the most suitable "roll" for their die-cutting process needs among the complex products. For customers who prioritize efficiency, stability, and quality, the selection of high-precision release films is by no means an overlooked aspect. Shenzhen Reechas technology focuses on the research, development and production of high-quality laminated materials (release films) and buffer materials (cushioning pads), providing you with high-quality auxiliary material services